Silicon Austria Labs (SAL)

Senior Scientist- Fan out wafer level packaging / Heterogeneous Integration Technologies (f/m/d)

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  • Coordination of infrastructure ramp up for FOWLP line at Silicon Austria labs
  • Development and optimization of FOWLP processes for both chip-first and chip-last approaches, including die placement, wafer-level molding, processing of RDL & TMV.
  • Designing fan-out package layouts, considering electrical performance, thermal dissipation, and reliability.
  • Concept development, DOE planning, and characterization in an interdisciplinary team
  • Development of FOWLP SIP for Power Electronics, MEMS and RF devices
  • Contributing to different industrial projects
  • Data analysis
  • Technical reporting and scientific dissemination
  • Project management


  • M.Sc. + 7 years of relevant working experience (or higher) in Physics, microsystems fabrication, power electronics and electronics engineering or relevant industrial experience
  • In-depth knowledge and hands-on experience with FOWLP processes, materials, and equipment.
  • Familiarity with packaging design tools, such as Cadence or Mentor Graphics for layout and design rule checks
  • Cleanroom and microfabrication experience
  • Project management experience as well as research funding proposals
  • Fluent oral and written communication skills in English, knowledge of German is a plus


  • Start of your employment as soon as possible.
  • State-of-the-art laboratory facilities and instruments.
  • Internal and external training opportunities for further technical and personal development.
  • Flexible working time and possibilities for Home Office .
  • € 4 /day food allowance in restaurants / € 2 /day in supermarkets.
  • Family & kids friendly.
  • Free coffee/milk/tea.

This position is subject to the Collective Agreement for employees in non-university research (Research CA) starting in occupational group F (F1 salary = EUR 4.226,- paid 14 times a year) based on 38,5 hours per week). For this position we offer competitive salaries and additional benefits based on your experience and qualifications, starting with a minimum salary of EUR 70.000 (annual, based on an All-in contract and bonus).

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Silicon Austria Labs (SAL) is a top research center for Electronic Based Systems (EBS). At three locations (Graz, Villach, Linz), SAL is conducting research along the entire EBS value chain in the areas of sensor systems, power electronics, RF (radiofrequency) systems, system integration and embedded systems to develop future-oriented solutions for industrial production, health, energy, mobility, safety and more. SAL brings together key players from industry, science and research and thus valuable expertise and know-how and conducts cooperative, application-oriented research along the value chain. Cooperative projects are co-financed by SAL and enable a fast and unbureaucratic project start. SAL is thus shaping the high-tech location Austria and Europe and developing the future  

Innovation is our top priority and so are our employees. We are a family-friendly company and support the compatibility of work and family as much as possible. That is why we have been awarded the Work and Family Certificate until 2023. But we are constantly working on new measures to offer our employees an environment where they feel good, healthy and motivated. 

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Informatie over de vacature

Senior Scientist- Fan out wafer level packaging / Heterogeneous Integration Technologies (f/m/d)
Inffeldgasse 33 Graz, Oostenrijk
Uiterste sollicitatiedatum
Soort functie
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